Tag Archives: DRAM

Samsung is announcing that they have succeeded in developing the industry’s first 10-nanometer (nm) class 8-gigabit (Gb) LPDDR5 DRAM.  This newly-developed 8Gb LPDDR5 is the next addition to Samsung’s premium DRAM product lineup, which includes previously-announced 10nm-class 16Gb GDDR6 DRAM that has been in volume production since December of 2017, and 16Gb DDR5 DRAM that was developed in February of …

Samsung Electronics Co., Ltd., a world-leading producer of high-performance memory devices, is announcing that it has begun mass production of the industry’s first 4-gigabyte (GB) DRAM package that is based on the 2nd generation High Bandwidth Memory (HBM2) interface. Targeted usage scenarios are high-performance computing, advanced graphics systems, advanced network systems, as well as enterprise servers. Samsung’s latest HBM solution …

Graphics card manufacturer, EVGA, has recently entered the desktop memory market, introducing a wide variety of new, competitively priced DDR3, and DDR4 memory kits to the market, which are currently available exclusively at Microcenter (in-store only). The company, which is new to the DRAM market, has released a total of 10 separate kits under their Superclocked and SuperSC (Super-Superclocked) brands, …

I am often amazed on the effort companies go to in their efforts to earn trusted customers, but when it comes to purchase, they seem to follow an opposite path.  We recently purchased a new Apple 27″ iMac and our configuration was complete in every aspect, except for the memory configuration.  We relied on the stock 8GB included memory simply …

Intel Corporation today announced its Intel Cache Acceleration Software (CAS) for Windows and Linux that prioritizes application performance, providing solid-state drive (SSD) levels of speed without migration costs, and built-in data integrity for Intel’s SSD data center family of products. The Linux version of the software will be generally available within 30 days as an enterprise subscription and open source …

Micron Technology, Inc. has targeted the ultra-thin computing market with reduced-height single-sided DDR3 DRAM modules and connector solutions.  They are announcing availability of a single-sided SODIMM and a low-profile, single-sided, double data rate (DDR3) SODIMM connector solution from TE Connectivity.  This new single-sided form factor will take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets, and other thin and light devices.  …