Tag Archives: MO268

Micron Technology, Inc. has targeted the ultra-thin computing market with reduced-height single-sided DDR3 DRAM modules and connector solutions.  They are announcing availability of a single-sided SODIMM and a low-profile, single-sided, double data rate (DDR3) SODIMM connector solution from TE Connectivity.  This new single-sided form factor will take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets, and other thin and light devices.  …

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